The University of Osaka · Engineering
Professor Jenn-Ming Song's research lab specializes in the development and characterization of advanced solder materials for electronic packaging, with a focus on lead-free solders such as Sn-Ag-Cu and Sn-Zn systems. The lab investigates the microstructure-property relationships of intermetallic compounds (IMCs) formed at solder/wire interfaces, emphasizing mechanical behavior, deformation mechanisms, and the effects of alloying elements like gallium on thermal stability and strength. Key research directions include microstructure evolution, solidification behavior, and the enhancement of mechanical performance through controlled alloying and processing parameters.
Figures are computed from collected data and may differ slightly.
This study evaluated mechanical behavior of the intermetallic compounds (IMCs) formed at the interfaces between potential Pb-free solders (Sn-Ag-Cu and Sn-Zn) and the wires of Cu and Ag under different loading rates. Compared to Ag based IMCs, Cu based IMCs were harder and stiffer, but less strain rate sensitive. The morphology of the indent impression was found depending on the ratio of the modulus to hardness, and the crystal structure of the IMCs.
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