Sungkyunkwan University · Engineering
Professor Jeong-Won Yoon's research lab specializes in advanced electronic packaging materials and interconnection technologies, with a strong focus on intermetallic compound growth kinetics, solder joint reliability, and high-temperature bonding processes. The lab investigates diffusion-controlled interfacial reactions in Sn-Bi and Sn-Ag-Bi solder systems with various substrates, including Ni-P/Cu and Au/Ni/Cu, under isothermal aging conditions. A key research direction involves developing low-cost, high-performance Cu-sintering technologies for power electronics, emphasizing process optimization and mechanical reliability. The lab also explores the microstructural evolution and activation energies of intermetallic phases to enhance the thermal and mechanical stability of electronic assemblies.
Figures are computed from collected data and may differ slightly.
The growth kinetics of intermetallic compound layers formed between eutectic Sn–58Bi solder and (Cu, electroless Ni–P/Cu) substrate were investigated at temperature between 70 and 120°C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn–58Bi/Cu and Sn–58Bi/electroless Ni–P system satisfied the parabolic law at given temperature range. As a whole, because the values of time exponent (n) have approximately 0.5, the layer growth of the intermetallic compound was ma
The growth kinetics of intermetallic compound (IMC) layers formed between Sn-3Ag-6Bi-2In ball-grid-array (BGA) solder and Au/Ni/Cu substrate by solid-state isothermal aging were examined at temperatures between 343 and 443 K for 0 to 100 days. A quantitative analysis of the IMC layer thickness as a function of time and temperature was performed. The intermetallic layer exhibited a parabolic growth at the given temperature range. Because the values of the time exponent (n) are approximately 0.5,
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