Tohoku University · Materials Science
이 교수의 연구실은 나노스케일 물질의 열전도 및 전자적 성질을 이해하고 응용하는 데 중점을 두고 있습니다. 그래핀 나노리본의 열전도 메커니즘, 토폴로지컬 절연체에서의 스핀 생성 및 유지 메커니즘, 그리고 고성능 열인터페이스 재료 개발을 핵심 연구 주제로 다룹니다. 특히, 나노재료의 구조적 특성과 열·전기적 성능 간의 상관관계를 분석함으로써 차세대 전자소자 및 에너지 효율 소재의 기초를 마련하고자 합니다.
Figures are computed from collected data and may differ slightly.
We have used molecular dynamics to calculate the thermal conductivity of symmetric and asymmetric graphene nanoribbons (GNRs) of several nanometers in size (up to approximately 4 nm wide and approximately 10 nm long). For symmetric nanoribbons, the calculated thermal conductivity (e.g., approximately 2000 W/m-K at 400 K for a 1.5 nm x 5.7 nm zigzag GNR) is on the similar order of magnitude of the experimentally measured value for graphene. We have investigated the effects of edge chirality and f
We have studied the effects of a disordered optical potential on the transport and phase coherence of a Bose-Einstein condensate (BEC) of $^{7}\text{L}\text{i}$ atoms. At moderate disorder strengths $({V}_{D})$, we observe inhibited transport and damping of dipole excitations, while in time-of-flight images, random but reproducible interference patterns are observed. In situ images reveal that the appearance of interference is correlated with density modulation, without complete fragmentation. A
Topological insulators (TIs), with their helically spin-momentum-locked topological surface states (TSSs), are considered promising for spintronics applications. Several recent experiments in TIs have demonstrated a current-induced electronic spin polarization that may be used for all-electrical spin generation and injection. We report spin potentiometric measurements in TIs that have revealed a long-lived persistent electron spin polarization even at zero current. Unaffected by a small bias cur
We developed high-performance thermal interface materials (TIMs) based on a few-layer graphene (FLG) composite, where FLG was prepared by the interlayer catalytic exfoliation (ICE) method. We experimentally demonstrated the feasibility of FLG composites as TIMs by investigating their thermal and mechanical properties and reliability. We measured the thermal interface resistance (Rint) between FLG composite TIMs (FLGTs) and copper to be 3.2 ± 1.7 and 4.3 ± 1.4 mm2 K/W for 5 vol % and 10 vol % FLG
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