In-Hee Kim
Korea Advanced Institute of Science and Technology · Engineering
About the Lab
Professor In-Hee Kim's research lab specializes in the design and optimization of application-specific digital signal processors (DSPs) for mobile and broadband communication systems. The lab focuses on developing high-performance, area-efficient DSP architectures integrated with specialized hardware accelerators—such as the Mobile Communication Accelerator (MCA)—to significantly enhance processing efficiency for key signal processing tasks like OFDM and Viterbi equalization. Their work emphasizes low-power, high-throughput implementations tailored for real-time baseband processing in 3G/4G mobile communication standards. The lab combines algorithmic innovation with custom VLSI design, targeting both FPGA prototyping and silicon fabrication using advanced CMOS processes.
Research Overview
Research Output Trend
Figures are computed from collected data and may differ slightly.
Selected Papers
3This paper describes implementation of an application-specific DSP for OFDM modem systems. The proposed instructions can support computations of various blocks in OFDM systems. The data ALU is specially designed and optimized for the proposed instruction. Performance comparisons show that the number of clock cycles improves over 10% compared with Carmel DSP and over 50% compared with TMS320C62X for FFT computation. However, the size of the DSP is much smaller than existing DSPs. The proposed arc
This paper describes a 16-bit programmable fixed-point digital signal processor, called MDSP-II, for mobile communication applications. The instruction set of MDSP-II was determined after a careful analysis of the Global System for Mobile communications (GSM) baseband functions. An application-specific hardware block called the mobile communication accelerator (MCA) was incorporated on chip to accelerate the execution of the key operations frequently appearing in Viterbi equalization. With the a
This paper describes a digital signal processor designed for mobile communication applications. The DSP, called MDSP-II, has a mobile communication accelerator which enables higher signal processing performance than the other general-purpose DSPs. With the assistance of the accelerator, the GSM baseband functions which usually need 53 million instructions per second can be performed only with 19 MIPS. MDSP-II fabricated on 9.7 mm/spl times/9.8 mm die with a 0.6-/spl mu/m TLM CMOS process operate
Research Areas
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