Jaeseon Lee
Ulsan National Institute of Science and Technology · Engineering
About the Lab
Professor Jaeseon Lee's research lab focuses on advanced thermal management solutions for high-power electronic systems, particularly in defense and aerospace applications, where extreme heat fluxes pose significant challenges. The lab also investigates the immunomodulatory roles of JAK/STAT signaling pathways in autoimmune diseases such as primary Sjögren's syndrome and systemic lupus erythematosus, exploring JAK inhibitors as potential therapeutics. Additionally, the lab examines stress response mechanisms involving heat shock proteins, especially the functional distinctions between closely related hsp70 isoforms in cellular protection and disease modulation. These interdisciplinary efforts bridge materials science, biomedical engineering, and molecular immunology to address critical technological and health challenges.
Research Overview
Research Output Trend
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Selected Papers
15<para xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> For a given heat sink thermal resistance and ambient temperature, the temperature of an electronic device rises fairly linearly with increasing device heat flux. This relationship is especially problematic for defense electronics, where heat dissipation is projected to exceed 1000 <formula formulatype="inline"> <tex Notation="TeX">${\hbox {W}}/{\hbox {cm}}^{2}$</tex></formula> in the near future. Dir
For a given heat sink thermal resistance and ambient temperature, the temperature of an electronic device rises fairly linearly with increasing device heat flux. This relationship is especially problematic for defense electronics, where heat dissipation is projected to exceed 1000 W/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> in the near future. Direct and indirect low temperature refrigeration cooling facilitate appreciable reduction
While most recently electronic cooling studies have been focused on removing the heat from high-power-density devices, the present study also explores means of greatly decreasing the device operating temperature. This is achieved by incorporating a microchannel heat sink as an evaporator in an R134a refrigeration loop. This system is capable of maintaining device temperatures below 55°C while dissipating in excess of 100W∕cm2. It is shown that while higher heat transfer coefficients are possible
Research Areas
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