Hyun Jae Kim

Abstract Solution processing, including printing technology, is a promising technique for oxide thin‐film transistor (TFTs) fabrication because it tends to be a cost‐effective process with high composition controllability and high throughput. However, solution‐processed oxide TFTs are limited by low‐performance and stability issues, which require high‐temperature annealing. This high thermal budget in the fabrication process inhibits oxide TFTs from being applied to flexible electronics. There h

Metal oxide thin-film transistors have been continuously researched and mass-produced in the display industry. However, their phototransistors are still in their infancy. In particular, utilizing metal oxide semiconductors as phototransistors is difficult because of the limited light absorption wavelength range and persistent photocurrent (PPC) phenomenon. Numerous studies have attempted to improve the detectable light wavelength range and the PPC phenomenon. Here, recent studies on metal oxide

High-pressure annealing (HPA) affected the thermodynamics of the formation of a solution-processed oxide film through the simultaneous modification of thermal decomposition and compression, and enabled the use of lower annealing temperatures, which was favourable for device implementation. HPA also reduced the film thickness and decreased the porosity, resulting in enhanced device characteristics at low temperature. Surface and depth profile characterization using X-ray reflectivity (XRR), X-ray

Based on the previously elucidated super lateral growth phenomenon, we have developed an excimer-laser-crystallization method that produces large-grained and grain-boundary- location-controlled Si films on SiO2 and which possesses a wide processing window. For the set of experiments reported in this letter, a patterned SiO2 capping layer on top of Si films is utilized as an anti-reflective coating in order to induce artificially controlled super-lateral growth in the film upon being irradiated w

Abstract Memory for skin‐attachable wearable devices for healthcare monitoring must meet a number of requirements, including flexibility and stability in external environments. Among various memory technologies, organic‐based resistive random‐access memory (RRAM) devices are an attractive candidate for skin‐attachable wearable devices due to the high flexibility of organic materials. However, organic‐based RRAMs are particularly vulnerable to external moisture, making them difficult to apply as

Solution-processed indium oxide TFTs were fabricated by hydroxyl radical-assisted (HRA) decomposition and oxidation.