The University of Osaka · Engineering
Professor T. Matsuda's research lab specializes in advanced materials processing and interfacial engineering, focusing on the development of high-strength, reliable joints in dissimilar materials such as aluminum, steel, and carbon fiber-reinforced thermoplastics through innovative welding techniques like friction stir spot welding (FSSW). The lab investigates the fundamental mechanisms linking microscale interfacial structures to macroscale mechanical properties, employing advanced characterization techniques such as TEM, nanoindentation, and positron annihilation spectroscopy. Recent work also explores ultrafast laser shock processing to induce nanocrystalline structures and novel bonding methods for metal-silicon systems without surface treatment, highlighting a strong emphasis on materials synthesis, microstructure control, and interfacial science.
Figures are computed from collected data and may differ slightly.
In this study, the synergistic effects of a hybrid surface treatment involving hydrochloric acid (HCl) immersion and silanization on friction stir spot welding (FSSW) of aluminum and carbon fiber reinforced thermoplastic (CFRTP) were investigated. Maximum tensile shear strength of 10.2 kN and maximum cross-tension strength of 1.92 kN were achieved. An unloading test and a miniature tensile test revealed that the fracture behavior changed from interfacial to CFRTP fracture due to increased interf
The macroscale mechanical properties of dissimilar joints are generally influenced by the fracture behavior of joint interface. However, little is known about the dominant factor for the joint properties related with both macroscale fracture behavior and microscale interfacial properties. Herein, microscale tensile testing of the joint interface was coupled with the macroscale fracture evaluation to elucidate the dominant factor of strength in dissimilar joints between 6061 aluminum alloy and hi
Silicon-based materials are widely promising electronic components by the combination with metals in power electronics field. However, bonding metal and silicon-based materials generally requires specific surface modification due to their different chemical bonds. Here, we demonstrate a process for directly bonding metals to silicon-based materials that does not require surface treatment, based on the in situ decomposition of Ag<sub>2</sub>O paste, forming Ag nanoparticles (AgNPs). We demonstrat
We found that multiple shots of femtosecond laser-driven shock pulses changed coarse crystalline iron grains with a size of 140 μm into nanocrystals with a high density of dislocations, which had never been observed in conventional shock processes. We performed metallurgical microstructure observations using transmission electron microscopy (TEM) and hardness measurements using nanoindentation on cross-sections of shocked iron. TEM images showed that grains with sizes from 10 nm through 1 μm exi
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