Yang Ju

Human bone marrow mesenchymal stem cells (hMSCs) have the potential to differentiate into tendon/ligament-like lineages when they are subjected to mechanical stretching. However, the means through which mechanical stretch regulates the tenogenic differentiation of hMSCs remains unclear. This study examined the role of RhoA/ROCK, cytoskeletal organization, and focal adhesion kinase (FAK) in mechanical stretch-induced tenogenic differentiation characterized by the up-regulation of tendon-related m

Cell adhesion, migration, and proliferation are significantly affected by the surface topography of the substrates on which the cells are cultured. Alumina is one of the most popular implant materials used in orthopedics, but few data are available concerning the cellular responses of mesenchymal stem cells (MSCs) grown on nanoporous structures. MSCs were cultured on smooth alumina substrates and nanoporous alumina substrates to investigate the interaction between surface topographies of nanopor

We present a method for quantitative measurement of electrical conductivity of semiconductor wafers in a contactless fashion by using millimeter waves. A focusing sensor was developed to focus a 110 GHz millimeter wave beam on the surface of a silicon wafer. The amplitude and the phase of the reflection coefficient of the millimeter wave signal were measured by which electrical conductivity of the wafer was determined quantitatively, independent of the permittivity and thickness of the wafers. T

To detect delamination in integrated circuit (IC) packages, a millimeter-wave inspection system was developed. An open-ended coaxial line sensor was used as a source and also a receiver of the millimeter-wave signal that was transmitted into and reflected from the packages. The phase of the reflection coefficient was measured for inspection of the delamination. The package was scanned in two perpendicular directions on a plane parallel to the package. A two-dimensional image was created by using

A micro-four-point probe technique for local electrical conductivity measurement is presented. An atomic force microscope (AFM) probe was fabricated into four parallel electrodes isolated from each other. Electrodes separated by a distance as small as 1.0μm were used to perform the current and electrical potential measurements. This technique is a combination of the principles of the four-point probe method and standard AFM. The equipment is capable of simultaneously measuring both surface topog

Mass production of surface mount devices (SMDs) relies heavily on reflow soldering and has become the cornerstone of today's electronic industry. However, the traditional reflow soldering technique is characterized by high heating temperatures, toxic solder materials and low recycling rate of SMDs. Here, we propose a new patterned structure of Au nanowire arrays named a surface fastener through which cold bonding for surface mount technology can be realized. The mechanical bonding enables normal