Chuantong Chen 교수

This work firstly evaluated the microscale mechanical properties of sintered Ag, consisting of various Ag particles of a flake shape and spherical shape from nano to micro size. Microscale pillar specimens were fabricated by a focused ion beam process and the mechanical properties of the sintered Ag, were measured by micro-compression testing using a nano-indentation system. The microstructure of sintered Ag is dependent upon the size and the shape of the utilized Ag particles, as this significa

Sintered silver (Ag) joining has attracted significant interest in power devices modules for its ability to form stable joints with a porous interconnection layer. A function for the self-healing of cracks in sintered porous Ag interlayers at high temperatures is discovered and reported here. A crack which was prepared on a Ag joining layer was closed after heating at 200 °C in air. The tensile strength of pre-cracked Ag joining layer specimens recovers to the value of non-cracked specimens afte

The thermal cycling life of direct bonded aluminum (DBA) and active metal brazing (AMB) substrates with two types of plating-Ni electroplating and Ni⁻P electroless plating-was evaluated by thermal shock tests between -50 and 250 °C. AMB substrates with Al₂O₃ and AlN fractured only after 10 cycles, but with Si₃N₄ ceramic, they retained good thermal stability even beyond 1000 cycles, regardless of the metallization type. The Ni layer on the surviving AMB substrates with Si₃N₄ was not damaged, whil

In this article, an SiC die was directly attached on a bare DBA (Al/AlN/Al) substrate via micron-sized Ag sintering at 250 °C without pressure. The micron-sized structure of the Ag–Al joint revealed robust bonding (33.6 MPa), which was attributed to the excellent sinterability of the Ag paste. A high-temperature storage test was conducted for 1000 h at 250 °C, and the thermal shock test was conducted from −50 to 250 °C for 2000 cycles. The shear strength was >30 MPa even after 1000 h of high-tem