Jiheong Kang 교수

An electronic (e-) skin is expected to experience significant wear and tear over time. Therefore, self-healing stretchable materials that are simultaneously soft and with high fracture energy, that is high tolerance of damage or small cracks without propagating, are essential requirements for the realization of robust e-skin. However, previously reported elastomers and especially self-healing polymers are mostly viscoelastic and lack high mechanical toughness. Here, a new class of polymeric mate

An elastic printed circuit board (E-PCB) is a conductive framework used for the facile assembly of system-level stretchable electronics. E-PCBs require elastic conductors that have high conductivity, high stretchability, tough adhesion to various components, and imperceptible resistance changes even under large strain. We present a liquid metal particle network (LMP_Net) assembled by applying an acoustic field to a solid-state insulating liquid metal particle composite as the elastic c

Because of a rapid conformational inversion, bowl-shaped C5-symmetric corannulenes, though geometrically chiral, have not been directly resolved into their enantiomers. However, if this inversion equilibrium can be desymmetrized, chiral corannulenes enriched in either enantiomer can be obtained. We demonstrated this possibility using pentasubstituted corannulenes 4 and 5 carrying amide-appended thioalkyl side chains. Compound 4 displays chiroptical activity in a chiral hydrocarbon such as limone

Abstract Electronics offering modularity in design and function, i.e., modular electronics have enabled a wide gamut of applications, such as promotion of creativity, self‐assembling robots, and customizable consumer electronics. In particular, there is recently a fertile application domain within the rapidly growing needs in wearable technologies. Toward this application, it is proposed that stretchable, self‐healable, and mechanically tough materials will enable a highly desirable reconfigurab

Abstract Additive manufacturing/3D printing is praised as revolutionary by many because it enables the decentralized and on‐demand manufacturing of complex shapes. With the ongoing rapid development and increased availability of these technologies, it has become crucial to develop novel materials with unique functionalities for 3D‐printed components. Advances in self‐healing materials have resulted in structures capable of recovering from physical damage through material remendability. By applyi

Abstract 3D displays are of great interest as next‐generation displays by providing intensified realism of 3D visual information and haptic perception. However, challenges lie in implementing 3D displays due to the limitation of conventional display manufacturing technologies that restrict the dimensional scaling of their forms beyond the 2D layout. Furthermore, on account of the inherent static mechanical properties of constituent materials, the current display form factors can hardly achieve r

Abstract Gallium‐based liquid metal (LM) has attracted considerable attention as a promising material for stretchable conductors due to its remarkable combination of deformability and metallic conductivity. However, LM inherently faces challenges such as high surface tension, resistance increase, electrical failure due to leakage, and limited mechanical stability. Recently, researchers have explored the concept of “dividing” bulk LM into microparticles (LMP) as a means of addressing these limita

Printed electronics received a great attention in both research and commercialization since it allows fabrication of low-cost, large area electronic devices on various substrates. Printed electronics plays a critical role in facilitating stretchable electronics since it allows patterning newly developed stretchable conductors which is difficult to be achieved with conventional silicon-based microfabrication technologies, such as photolithography and vacuum-based techniques. To realize printed el

Soft materials are polymer networks that can be easily deformed by external forces. Incorporating dynamic bonds into these networks imparts various functionalities─such as self-healing, recyclability, and 3D printability─by enabling fast and reversible bond formation. However, the relatively short lifetimes of dynamic bonds compared with permanent covalent bonds can compromise the mechanical robustness of the material. This review highlights design strategies that harness dynamic bonds effective