Junghyeon Hwang
KAIST 전기 및 전자공학부 · 공학
황정현 교수의 연구실은 허피아 기반 페로일렉트릭 소재와 장치를 중심으로, 첨단 반도체 공정과의 호환성과 고밀도 통합이 가능한 차세대 비휘발성 메모리 및 뉴로모픽 컴퓨팅 소자 개발에 주력하고 있습니다. 특히 페로일렉트릭 터널 재료의 성능 향상을 위해 고압 열처리, 산화티타늄 인터페이스 삽입, 저손상 메탈라이제이션 공정 등 혁신적인 공정 기술을 도입하여 터널 전기저항비(TER) 비율과 내구성을 극대화하고 있습니다. 연구는 FeFET, FTJ, CiM(메모리 내 계산) 등 다양한 응용 분야로 확장되며, 미래형 컴퓨팅 아키텍처의 핵심 기술 기반을 마련하고 있습니다.
표시된 성과는 수집된 데이터 기준으로 산출되며, 일부 차이가 있을 수 있습니다.
The various structures of ferroelectric tunnel junctions (FTJs) are widely studied. Among them, metal-ferroelectric-semiconductor (MFS) FTJs show great tunneling electroresistance (TER) ratio by forming a depletion region. However, the poor ferroelectricity of hafnia on semiconductor electrodes degrades the TER ratio. This study employed high-pressure annealing with forming gas to improve the ferroelectric properties of MFS FTJs. We achieved a high 2Pr value (47.54 μc/cm <sup xmlns:mml="http://w
The interest in ferroelectric tunnel junctions (FTJ) has been revitalized by the discovery of ferroelectricity in fluorite-structured oxides such as HfO<sub>2</sub> and ZrO<sub>2</sub> . In terms of thickness scaling, CMOS compatibility, and 3D integration, these fluorite-structured FTJs provide a number of benefits over conventional perovskite-based FTJs. Here, recent developments involving all FTJ devices with fluorite structures are examined. The transport mechanism of fluorite-structured FTJ
Hafnia-based ferroelectric (FE) devices have attracted significant attention as nonvolatile memory devices due to their compatibility with complementary metal–oxide–semiconductor processes. Among them, the FE tunnel junction (FTJ) has been considered as the next-generation of nonvolatile memory devices owing to its neuromorphic characteristics and nondestructive read operation as well as the high-density integration. However, degradation of ferroelectricity in a thin hafnia film causes a reduced
We demonstrate that a non-volatile majority function logic is formed by a 1T-nC <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{storage}$ </tex-math></inline-formula> -1C <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{read}$ </tex-math></inline-formula> cell in which a hafnia ferroelectric capacitor is used for computin
Hafnia-based ferroelectric field-effect transistors (FeFETs) with low power, scalability, and nonvolatile switching can overcome the performance limitations of conventional von Neumann computing technology. However, achieving a large memory window and excellent endurance in FeFET devices composed of two capacitors, such as ferroelectric and interfacial insulator capacitors, remains a challenge due to the strong electric field applied to the insulator, which accounts for the low permittivity ( <i
This study presents a low-damage metallization process for ultra-thin hafnia-based ferroelectric films, achieving high polarization, low leakage currents, and reduced wake-up effect, paving the way for scalable and reliable FeRAM applications.
Metal-ferroelectric-metal-insulator-semiconductor (MFMIS) FeFETs have significant potential for use in non-volatile memory applications. This is primarily due to their compatibility with CMOS technology and reliable switching characteristics. Previous studies have primarily concentrated on the endurance and memory window properties, while this study focuses on the short-term (<<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math not
In this study, we present a remarkable improvement in the performance of hafnia-based ferroelectric tunnel junctions (FTJs) using oxygen scavenging technology and extremely low-damage (ELD) deposition, leading to a significant increase in the tunneling electroresistance ratio $({\mathrm {TER}}) (\gt 2 \times 10^{4})$, on-current density $(\gt 10^{-2}\mathrm{A} /cm^{2})$, and self-rectifying ratio $({\mathrm {RR}}) (\gt 1.5 \times 10^{3})$. First-principles DFT simulations were also used to evalu
An ultrathin InO interlayer supplies oxygen to HZO, curing the interface and thinning the dead layer, enabling more uniform ferroelectric switching with lower leakage and improved reliability.
Short O 2 RTA converts Mo into a MoO x -rich interface ( φ ≥ 5.5 eV), suppressing trap formation and stabilizing imprint in HZO. This in-situ route avoids sputtered MoO 3 and enables robust FTJ endurance.