한양대학교 · 공학
Kyung-Young Jhang 교수의 연구실은 비파괴 검사 기술, 특히 비선형 초음파를 중심으로 재료의 피로, 노화, 기계적 변형 등에 의한 손상 평가를 연구하고 있습니다. 주로 고체 내부의 미세 구조 변화와 물성 변화를 비접촉 방식으로 정량적으로 분석하는 데 초점을 맞추고 있으며, 특히 금속 3D 프린팅, 고온 소재의 노화, 반도체 웨이퍼의 균열 검출 등 실제 산업 응용에 기여할 수 있는 기술 개발을 진행하고 있습니다. 비선형 초음파의 비율 및 비선형도 파arameter를 정량화하는 신뢰성 높은 측정 기법 개발도 핵심 과제입니다.
표시된 성과는 수집된 데이터 기준으로 산출되며, 일부 차이가 있을 수 있습니다.
Nonlinear ultrasonics is suggested as a new approach for the effective evaluation of material degradation. As its quantification, the parameter beta is introduced on the basis of nonlinear elasticity, and a new method to measure the parameter beta using bispectral analysis is proposed. Then, the correlation between beta and material degradation is investigated. From the results for several mild steel (SS41, SS45) specimens that were degraded by stretching and cyclic loads, it was confirmed that
Metal additive manufacturing (AM) is an innovative manufacturing technology that uses a high-power laser for the layer-by-layer production of metal components. Despite many achievements in the field of AM, few studies have focused on the nondestructive characterization of microstructures, such as grain size and porosity. In this study, various microstructures of additively manufactured metal components were characterized non-destructively using linear/nonlinear ultrasonic techniques. The contrib
The ultrasonic nonlinear parameter is measured from the amplitudes of the harmonic frequency components generated during the propagation of ultrasonic waves in a material. There are two definitions for this parameter: absolute and relative. The absolute parameter is defined by the displacement amplitude; however, it is difficult to measure because of the very small displacement amplitude of the harmonic components. Conversely, the relative parameter is defined by the amplitude of the detected si
In the semiconductor industry, with increasing requirements for high performance, high capacity, high reliability, and compact components, the crack has been one of the most critical issues in accordance with the growing requirement of the wafer-thinning in recent years. Previous researchers presented the crack detection on the silicon wafers with the air-coupled ultrasonic method successfully. However, the high impedance mismatching will be the problem in the industrial field. In this paper, in