Kyushu University · 공학
Xin Fu Tan 교수의 연구실은 주로 전자소자 및 에너지 저장 장치에서의 합금 상의 거동을 중심으로 연구를 진행하고 있습니다. 특히 구리-锡계 인터메탈릭 화합물(Cu₆Sn₅ 등)과 스토크-铋계 낮은 융점 솔더(Sn-Bi 등)의 상화학적 거동, 미세구조 변화, 그리고 리튬이on 배터리 및 솔더 재료에서의 거친 동역학을 고해상도 전자현미경 기법(예: HV-TEM, in-situ SEM)을 통해 실시간으로 분석하고 있습니다. 연구는 나노미세 구조 제어와 재료의 열적 안정성 향상에 초점을 맞추고 있습니다.
표시된 성과는 수집된 데이터 기준으로 산출되며, 일부 차이가 있을 수 있습니다.
Intermetallics such as Cu6Sn5, NiSi2, and CuGa2 etc., are promising candidate materials to replace carbon-based lithium-ion battery anodes. However, the lithiation reactions of these anodes often involve the separation of the inactive phases, a slow process that retards the lithiation kinetics and deactivates their role as a stress buffer. This research visualizes the separated Cu in a lithiated Cu6Sn5 anode by advanced transmission electron microscopy techniques. Cu nanospheres of 3–4 nm are fo
Alloys based on the Sn-Bi system are widely considered as the most promising candidates for low temperature solders (LTS) in the electronics industry due to their low liquidus temperature, non-toxicity and relatively low cost. However, implementation of LTS is complicated as they exhibit different characteristics from conventional Pb-free solders. While the solid solubility of alloying additions in Sn is typically <1 wt% in the current generation of Pb-free solders, the solubility of Bi in Sn ra
Abstract Cu 6 Sn 5 is the most common intermetallic compound (IMC) in lead-free solder joints, and is also a promising anode material for advanced lithium-ion batteries. It has been reported that the growth rates of (Cu,Ni) 6 Sn 5 in Sn-based solder alloy/Cu-xNi substrate couples are greatly accelerated compared to the intermetallic layers that form on a pure Cu substrate. Due to the faster growth rates, solidification can progress through a transient-liquid-phase reaction in commercially releva
The complex reaction between liquid solder alloys and solid substrates has been studied ex-situ in a few studies, utilizing creative setups to "freeze" the reactions at different stages during the reflow soldering process. However, full understanding of the dynamics of the process is difficult due to the lack of direct observation at micro- and nano-meter resolutions. In this study, high voltage transmission electron microscopy (HV-TEM) is employed to observe the morphological changes that occur
