[논문 리뷰] Roadmapping the Next Generation of Silicon Photonics

Sudip Shekhar, Wim Bogaerts외 5명|arXiv (Cornell University)|2023. 05. 25.

Photonic and Optical Devices인용 수 19

한 줄 요약

이 문서는 generations 추세, 도전 과제 및 기회를 식별하는 관점 로드맵으로, 실리콘 포토닉스를 from millions to billions of units 확장하기 위한 디바이스, 통합 및 패키징을 커버하며 커뮤니케이션, 센싱 및 컴퓨팅을 다룬다.

ABSTRACT

Silicon photonics has developed into a mainstream technology driven by advances in optical communications. The current generation has led to a proliferation of integrated photonic devices from thousands to millions - mainly in the form of communication transceivers for data centers. Products in many exciting applications, such as sensing and computing, are around the corner. What will it take to increase the proliferation of silicon photonics from millions to billions of units shipped? What will the next generation of silicon photonics look like? What are the common threads in the integration and fabrication bottlenecks that silicon photonic applications face, and which emerging technologies can solve them? This perspective article is an attempt to answer such questions. We chart the generational trends in silicon photonics technology, drawing parallels from the generational definitions of CMOS technology. We identify the crucial challenges that must be solved to make giant strides in CMOS-foundry-compatible devices, circuits, integration, and packaging. We identify challenges critical to the next generation of systems and applications - in communication, signal processing, and sensing. By identifying and summarizing such challenges and opportunities, we aim to stimulate further research on devices, circuits, and systems for the silicon photonics ecosystem.

연구 동기 및 목표

• Chart generational trends in silicon photonics by analogy to CMOS generations (SSI, MSI, LSI, VLSI) and project future scaling.
• Identify integration, fabrication, and packaging bottlenecks that hinder CMOS-foundry-compatible silicon photonics.
• Highlight critical applications (communication, signal processing, sensing) and what must be solved to enable broader deployment.
• Summarize emerging technologies and pathways (materials, heterogeneous integration, packaging) to stimulate further research.
• Provide a systems-oriented perspective to guide device, circuit, and system development within the silicon photonics ecosystem.

제안 방법

• Review and synthesize historical and current silicon photonics progress across generations (SSI to VLSI).
• Identify key material, device, and packaging bottlenecks using CMOS-foundry benchmarks.
• Assess emerging technologies (e.g., Ge photodetectors, SiN, LNOI, heterogeneous/hybrid integration, advanced packaging) as potential solutions.
• Discuss E/O modulation, laser integration, avalanche photodetectors, and delay engineering within a system-level context.
• Propose a systems perspective linking photonics with electronics ecosystem and co-design opportunities.

실험 결과

연구 질문

• RQ1 What will it take to increase silicon photonics proliferation from millions to billions of units shipped?
• RQ2 What will the next generation of silicon photonics look like in terms of devices, integration, and packaging?
• RQ3 What common threads exist in integration and fabrication bottlenecks across silicon photonics applications, and which emerging technologies can address them?
• RQ4 How can CMOS-foundry-compatible processes and packaging be advanced to enable scalable systems for communication, sensing, and computing?
• RQ5 What are the strategic pathways (materials, integration, and system design) to stimulate continued growth of the silicon photonics ecosystem?

주요 결과

• Silicon photonics follows generational progression similar to CMOS, moving from SSI to MSI to LSI and toward VLSI with increasing component counts per PIC.
• CMOS-foundry constraints drive need for scalable, low-cost, high-yield integration, with emphasis on heterogeneous/hybrid integration and advanced packaging.
• Critical bottlenecks include E/O modulation efficiency, laser integration, passive alignment packaging, and delay/phase-shifting mechanisms, all affecting density and power.
• Emerging materials and approaches (Ge photodetectors, SiN waveguides, LNOI modulators, BTO, polymers, MEMS/NOEMS, phase-change materials) offer potential improvements but require CMOS-compatible integration and heat management.
• A systems perspective shows strong interdependence between photonics and electronics ecosystems, with co-design opportunities to optimize data links, DSP, and thermal/aero/dynamic performance.