Hiroshi Fujioka
東京大学 · 物理学・天文学
研究室紹介
富岡博教授の研究室では、スパッタリング法を用いたGaN半導体薄膜の低コスト・大面積成膜技術の開発を柱としています。特に、金属フォイルや多層グラフェン/アモルファス酸化シリコン基板を基板として用い、高品質なGaN薄膜のエpitaxial成長と極性制御を実現しています。これにより、大面積かつ柔軟なGaNベースの発光デバイスや高電子移動度トランジスタ(HEMT)の実現が目指されています。
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Selected Papers
6GaN films were grown on a multilayer graphene (MLG)/amorphous SiO2 stack by pulsed sputtering deposition and their structural properties were investigated. The GaN films on MLG show high c-axis orientation. In addition, the GaN films exhibit coexisting zincblende and wurtzite phases, but the zincblende phase is suppressed by the insertion of AlN interlayers. The polarity control of the GaN films was demonstrated using AlN interlayers with and without surface oxidation. These results indicate tha
Abstract This paper reports AlN barrier Al 0.5 Ga 0.5 N high electron mobility transistors (HEMTs) with heavily Si-doped degenerate GaN contacts prepared by pulsed sputtering deposition. Selectively regrown n-type GaN contacts exhibit typical degenerate properties with the electron concentration and mobility of 2.6 × 10 20 cm −3 and 115 cm 2 V −1 s −1 , respectively, resulting in a record low contact resistance R C of 0.43 Ω mm for the AlN/Al 0.5 Ga 0.5 N HEMTs. The AlN/Al 0.5 Ga 0.5 N HEMTs dis
GaN-based light-emitting diodes (LEDs) have been widely accepted as highly efficient solid-state light sources capable of replacing conventional incandescent and fluorescent lamps. However, their applications are limited to small devices because their fabrication process is expensive as it involves epitaxial growth of GaN by metal-organic chemical vapor deposition (MOCVD) on single crystalline sapphire wafers. If a low-cost epitaxial growth process such as sputtering on a metal foil can be used,
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