The University of Osaka · Engineering
히로시 니시카와 교수의 연구실은 고분자 화학과 나노소재의 상호작용을 중심으로, 특히 구리(II) 이온과 폴리비닐피리딘 유도체 간의 복합화 거동을 연구합니다. 나노입자 기반 접합 기술, 특히 구리 나노입자 페인트를 이용한 고온에서의 고체 접합 공정 개발에도 주력하고 있으며, 전자소자 조립 및 고온 응용 분야에서의 신뢰성 있는 접합 기술을 목표로 합니다.
Figures are computed from collected data and may differ slightly.
ADVERTISEMENT RETURN TO ISSUEPREVArticleComplexation and form of poly(vinylpyridine) derivatives with copper(II) in aqueous solutionHiroshi Nishikawa and Eishun TsuchidaCite this: J. Phys. Chem. 1975, 79, 19, 2072–2076Publication Date (Print):September 1, 1975Publication History Published online1 May 2002Published inissue 1 September 1975https://pubs.acs.org/doi/10.1021/j100586a018https://doi.org/10.1021/j100586a018research-articleACS PublicationsRequest reuse permissionsArticle Views232Altmetri
High-temperature bonding, or joining, is a key technology for electronic component assembly and other hightemperature applications. Recently, focusing on the sintering behavior of nanoparticles, the joining process using a nanoparticle paste has been proposed as an alternative to soldering for high-temperature applications. In this study, Cu nanoparticle paste was used to join two Cu discs, and the effect of joining conditions on the joint strength of the Cu-to-Cu joint was investigated. Joining
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