大阪大学 · 工学
Jenn-Ming Song教授の研究室では、鉛フリーはんだ接合部の機械的挙動と界面インタメタルリック化合物（IMC）の特性に注目し、特にSn-Ag-CuやSn-Zn系はんだとCu・Ag端子間の界面挙動を、応力速度の違いを考慮して評価しています。Gaを添加したSn-Zn合金の微細組織と熱・機械的特性の変化についても、固溶強化や凝固挙動の変化を解明しています。主な目的は、高信頼性な電子実装材料の開発と、接合界面の破壊挙動のメカニズム解明です。
Figures are computed from collected data and may differ slightly.
This study evaluated mechanical behavior of the intermetallic compounds (IMCs) formed at the interfaces between potential Pb-free solders (Sn-Ag-Cu and Sn-Zn) and the wires of Cu and Ag under different loading rates. Compared to Ag based IMCs, Cu based IMCs were harder and stiffer, but less strain rate sensitive. The morphology of the indent impression was found depending on the ratio of the modulus to hardness, and the crystal structure of the IMCs.
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