Tohoku University · 材料科学
Yong P. Chen教授の研究室では、ナノスケールの物質における熱伝導・スピン輸送・量子物性を、分子動力学シミュレーションや実験的手法を融合して研究しています。特にグラフェンナノリボンの熱伝導特性や、トポロジカル絶縁体における長寿命スピン偏極の発現を解明しており、次世代のエナジー効率の高いスピンデバイスの開発に貢献しています。また、高効率熱界面材料の開発を通じて、半導体デバイスの熱管理技術の革新にも注力しています。
Figures are computed from collected data and may differ slightly.
We have used molecular dynamics to calculate the thermal conductivity of symmetric and asymmetric graphene nanoribbons (GNRs) of several nanometers in size (up to approximately 4 nm wide and approximately 10 nm long). For symmetric nanoribbons, the calculated thermal conductivity (e.g., approximately 2000 W/m-K at 400 K for a 1.5 nm x 5.7 nm zigzag GNR) is on the similar order of magnitude of the experimentally measured value for graphene. We have investigated the effects of edge chirality and f
We have studied the effects of a disordered optical potential on the transport and phase coherence of a Bose-Einstein condensate (BEC) of $^{7}\text{L}\text{i}$ atoms. At moderate disorder strengths $({V}_{D})$, we observe inhibited transport and damping of dipole excitations, while in time-of-flight images, random but reproducible interference patterns are observed. In situ images reveal that the appearance of interference is correlated with density modulation, without complete fragmentation. A
Topological insulators (TIs), with their helically spin-momentum-locked topological surface states (TSSs), are considered promising for spintronics applications. Several recent experiments in TIs have demonstrated a current-induced electronic spin polarization that may be used for all-electrical spin generation and injection. We report spin potentiometric measurements in TIs that have revealed a long-lived persistent electron spin polarization even at zero current. Unaffected by a small bias cur
We developed high-performance thermal interface materials (TIMs) based on a few-layer graphene (FLG) composite, where FLG was prepared by the interlayer catalytic exfoliation (ICE) method. We experimentally demonstrated the feasibility of FLG composites as TIMs by investigating their thermal and mechanical properties and reliability. We measured the thermal interface resistance (Rint) between FLG composite TIMs (FLGTs) and copper to be 3.2 ± 1.7 and 4.3 ± 1.4 mm2 K/W for 5 vol % and 10 vol % FLG
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