The University of Osaka · 工学
西川博教授の研究室は、高分子と金属イオンの錯体形成、特にポリビニルピリジン誘導体と銅(II)の水溶液中での錯化挙動を解析することで、機能性高分子材料の設計と応用を追求しています。特に、ナノ粒子を用いた高融点接合技術の開発にも関与し、電子部品の高耐久接合技術の確立を目指しています。この分野における錯体の構造と安定性の解明が、次世代電子材料の開発に貢献しています。
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ADVERTISEMENT RETURN TO ISSUEPREVArticleComplexation and form of poly(vinylpyridine) derivatives with copper(II) in aqueous solutionHiroshi Nishikawa and Eishun TsuchidaCite this: J. Phys. Chem. 1975, 79, 19, 2072–2076Publication Date (Print):September 1, 1975Publication History Published online1 May 2002Published inissue 1 September 1975https://pubs.acs.org/doi/10.1021/j100586a018https://doi.org/10.1021/j100586a018research-articleACS PublicationsRequest reuse permissionsArticle Views232Altmetri
High-temperature bonding, or joining, is a key technology for electronic component assembly and other hightemperature applications. Recently, focusing on the sintering behavior of nanoparticles, the joining process using a nanoparticle paste has been proposed as an alternative to soldering for high-temperature applications. In this study, Cu nanoparticle paste was used to join two Cu discs, and the effect of joining conditions on the joint strength of the Cu-to-Cu joint was investigated. Joining
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