Sungkyunkwan University · 医学
Professor Jong Man Kim's research lab specializes in advanced on-chip communication architectures, with a primary focus on Network-on-Chip (NoC) design for next-generation multi-core and 3D integrated circuits. The lab explores energy-efficient, low-latency, and reliable NoC solutions, particularly through adaptive and path-sensitive routing algorithms, congestion-aware flow control, and fault-tolerant mechanisms tailored for deep sub-micron technologies. A key research direction involves integrating packet-based NoC paradigms into three-dimensional (3D) chip architectures to minimize interconnect delays and global wiring length. The lab also emphasizes performance modeling and evaluation using queuing-theory-based approaches to optimize energy efficiency and system reliability.
Figures are computed from collected data and may differ slightly.
The increased deployment of System-on-Chip designs has drawn attention to the limitations of on-chip interconnects. As a potential solution to these limitations, Networks-on -Chip (NoC) have been proposed. The NoC routing algorithm significantly influences the performance and energy consumption of the chip. We propose a router architecture which utilizes adaptive routing while maintaining low latency. The two-stage pipelined architecture uses look ahead routing, speculative allocation, and optim
Much like multi-storey buildings in densely packed metropolises, three-dimensional (3D) chip structures are envisioned as a viable solution to skyrocketing transistor densities and burgeoning die sizes in multi-core architectures. Partitioning a larger die into smaller segments and then stacking them in a 3D fashion can significantly reduce latency and energy consumption. Such benefits emanate from the notion that inter-wafer distances are negligible compared to intra-wafer distances. This attri
Packet-based on-chip networks are increasingly being adopted in complex System-on-Chip (SoC) designs supporting numerous homogeneous and heterogeneous functional blocks. These Network-on-Chip (NoC) architectures are required to not only provide ultra-low latency, but also occupy a small footprint and consume as little energy as possible. Further, reliability is rapidly becoming a major challenge in deep sub-micron technologies due to the increased prominence of permanent faults resulting from ac
Network-on-Chip (NoC) architectures employing packet-based communication are being increasingly adopted in System-on-Chip (SoC) designs. In addition to providing high performance, the fault tolerance and reliability of these networks is becoming a critical issue due to several artifacts of deep sub-micron technologies. Consequently, it is important for a designer to have access to fast methods for evaluating the performance, reliability, and energy-efficiency of an on-chip network. Towards this
This study is a good indicator of the post-LT prognosis in the Korean population and suggests a significant burden of post-LT complications.
Much like multi-storey buildings in densely packed metropolises, three-dimensional (3D) chip structures are envisioned as a viable solution to skyrocketing transistor densities and burgeoning die sizes in multi-core architectures. Partitioning a larger die into smaller segments and then stacking them in a 3D fashion can significantly reduce latency and energy consumption. Such benefits emanate from the notion that inter-wafer distances are negligible compared to intra-wafer distances. This attri
Our study suggests that preoperative ALP levels (≥ 80 IU/L) and intrahepatic metastases could be utilized to monitor and predict recurrence in HCC patients.
Packet-based on-chip networks are increasingly being adopted in complex system-on-chip (SoC) designs supporting numerous homogeneous and heterogeneous functional blocks. These network-on-chip (NoC) architectures are required to not only provide ultra-low latency, but also occupy a small footprint and consume as little energy as possible. Further, reliability is rapidly becoming a major challenge in deep sub-micron technologies due to the increased prominence of permanent faults resulting from ac
Clinical outcomes were mostly influenced by tumor stage and underlying liver function, and the impact of BDTT to survival seemed less prominent than vascular invasion. Therefore, an aggressive surgical approach, including major liver resection combined with bile duct resection, to increase the chance of R0 resection is strongly recommended.
Massive intraoperative bleeding during liver transplantation often requires large amounts of blood products. The goal of this study was to investigate long-term outcomes of living donor liver transplantation (LDLT) recipients with hepatocellular carcinoma (HCC) who underwent intraoperative use of intraoperative blood salvage (IBS) and leukocyte depletion filter (LDF). In this study, we included 230 LDLT recipients with HCC from two transplantation centers, between February 2002 and December 2007
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