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Seongkwang Kim

Korea University · 情報科学

研究室紹介

Professor Seongkwang Kim's research lab specializes in advanced semiconductor materials and devices, with a focus on heterogeneous integration of III–V and group IV semiconductors for next-generation optoelectronic and electronic systems. The lab develops high-performance photodetectors, including broadband and high-speed devices based on InGaAs, MoS₂ heterojunctions, and novel structures like guided-mode resonance and vertical biristors. Key research directions include low-temperature monolithic 3D integration, high-efficiency photodetection across visible to short-wavelength infrared (SWIR), and the design of lightweight, secure hardware primitives for post-quantum cryptography.

photodetectorsheterogeneous integrationIII-V semiconductorsoptoelectronicspost-quantum cryptography

Research Overview

Papers
23
Total Citations
305
Papers (5y)
12
Primary Field
情報科学

Research Output Trend

Figures are computed from collected data and may differ slightly.

Publications per year (5y)
12total
2022
2023
2024
2025
2026
Citations per year (5y)
111total
20222023202420252026

Selected Papers

15
1
Article|46 citations·2024
Highly-efficient (>70%) and Wide-spectral (400–1700 nm) sub-micron-thick InGaAs photodiodes for future high-resolution image sensors
Dae‐Myeong Geum, Jinha Lim, Junho Jang, Seung-Yeop Ahn, Seongkwang Kim, Joonsup Shim, Bong Ho Kim, Juhyuk Park, Woo Jin Baek, Jaeyong Jeong, Sanghyeon Kim, Sanghyeon Kim
SJR Q1Light Science & ApplicationsOA

Abstract This paper demonstrates the novel approach of sub-micron-thick InGaAs broadband photodetectors (PDs) designed for high-resolution imaging from the visible to short-wavelength infrared (SWIR) spectrum. Conventional approaches encounter challenges such as low resolution and crosstalk issues caused by a thick absorption layer (AL). Therefore, we propose a guided-mode resonance (GMR) structure to enhance the quantum efficiency (QE) of the InGaAs PDs in the SWIR region with only sub-micron-t

Electrical and Electronic EngineeringEngineering
2
Book Chapter|43 citations·2021
Transciphering Framework for Approximate Homomorphic Encryption
Jihoon Cho, Jincheol Ha, Seongkwang Kim, Byeonghak Lee, Joohee Lee, Jooyoung Lee, Dukjae Moon, Hyo‐Jin Yoon
SJR Q2Lecture notes in computer science
Artificial IntelligenceComputer Science
3
Article|40 citations·2021
Arrayed MoS2–In0.53Ga0.47As van der Waals Heterostructure for High‐Speed and Broadband Detection from Visible to Shortwave‐Infrared Light
Dae‐Myeong Geum, Suhyun Kim, Suhyun Kim, JiHoon Khym, Jinha Lim, Seongkwang Kim, Seongkwang Kim, Seung-Yeop Ahn, Tae Soo Kim, Kibum Kang, Sanghyeon Kim, Sanghyeon Kim
SJR Q1Small

Abstract A high‐speed and broadband 5 × 5 photodetector array based on MoS 2 /In 0.53 Ga 0.47 As heterojunction is successfully demonstrated to take full advantage of the type‐II band‐aligned multilayer MoS 2 /In 0.53 Ga 0.47 As. The fabricated devices exhibit good uniformity in the Raman spectrum and clear rectifying characteristics. The fabricated MoS 2 /In 0.53 Ga 0.47 As photodetectors show good optical performances at a broad wavelength range showing high responsivities corresponding to the

Materials ChemistryMaterials Science
4
Book Chapter|34 citations·2022
Rubato : Noisy Ciphers for Approximate Homomorphic Encryption
Jincheol Ha, Seongkwang Kim, Byeonghak Lee, Jooyoung Lee, Mincheol Son
SJR Q2Lecture notes in computer science
Artificial IntelligenceComputer Science
5
Article|32 citations·2018
Heterogeneous Integration Toward a Monolithic 3-D Chip Enabled by III–V and Ge Materials
Sanghyeon Kim, Seongkwang Kim, Jae‐Phil Shim, Dae-Myeong Geum, Gunwu Ju, Han-Sung Kim, Hee-Jeong Lim, Hyeong-Rak Lim, Jae-Hoon Han, Subin Lee, Ho-Sung Kim, Pavlo Bidenko
SJR Q2IEEE Journal of the Electron Devices SocietyOA

Monolithic 3-D integration has emerged as a promising technological solution for traditional transistor scaling limitations and interconnection bottleneck. The challenge we must overcome is a processing temperature limit for top side devices in order to ensure proper performance of bottom side devices. To solve this problem, we developed a low temperature III–V and Ge layer stacking process using wafer bonding and epitaxial lift-off, since these materials can be processed at a low temperature an

Electrical and Electronic EngineeringEngineering
6
Article|28 citations·2020
Masta: An HE-Friendly Cipher Using Modular Arithmetic
Jincheol Ha, Seongkwang Kim, Wonseok Choi, Jooyoung Lee, Dukjae Moon, Hyo‐Jin Yoon, Jihoon Cho
SJR Q1IEEE AccessOA

The Rasta cipher, proposed by Dobraunig et al. (CRYPTO 2018), is an HE-friendly cipher enjoying the fewest ANDs per bit and the lowest ANDdepth among the existing ciphers. A novel feature of Rasta is that its affine layers are freshly and randomly generated for every encryption. In this paper, we propose a new variant of Rasta, dubbed Masta. Similarly to Rasta, Masta takes as input a (master) secret key and a nonce, and generates a keystream block for each counter. On the other hand, Masta has t

Artificial IntelligenceComputer Science
7
Book Chapter|26 citations·2020
Tight Security Bounds for Double-Block Hash-then-Sum MACs
Seongkwang Kim, Byeonghak Lee, Jooyoung Lee
SJR Q2Lecture notes in computer science
Artificial IntelligenceComputer Science
8
Article|19 citations·2023
AIM: Symmetric Primitive for Shorter Signatures with Stronger Security
Seongkwang Kim, Jincheol Ha, M. H. Son, Byeonghak Lee, Dukjae Moon, Joohee Lee, Sangyub Lee, Jihoon Kwon, Jihoon Cho, H. Yoon, Jooyoung Lee

Post-quantum signature schemes based on the MPC-in-the-Head (MPCitH) paradigm are recently attracting significant attention as their security solely depends on the one-wayness of the underlying primitive, providing diversity for the hardness assumption in post-quantum cryptography. Recent MPCitH-friendly ciphers have been designed using simple algebraic S-boxes operating on a large field in order to improve the performance of the resulting signature schemes. Due to their simple algebraic structu

Artificial IntelligenceComputer Science
9
Article|17 citations·2021
Vertical InGaAs Biristor for Sub-1 V Operation
Wu‐Kang Kim, Pavlo Bidenko, Jongmin Kim, Jaeho Sim, Joon‐Kyu Han, Seongkwang Kim, Dae‐Myeong Geum, Sanghyeon Kim, Yang‐Kyu Choi
SJR Q1IEEE Electron Device Letters

A vertical bi-stable resistor (biristor) composed of In <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.53</sub> Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.47</sub> As was demonstrated for sub-1 V operation. An inherent small bandgap and a scaled base length of 150 nm led to the remarkable reduction in latch-up voltage compared to Si(Ge)-based conventional biristors. The epitaxially grown n-

Electrical and Electronic EngineeringEngineering
10
Article|4 citations·2023
Examination of Ferroelectric FET for “Cold” Nonvolatile Memory
Song‐Hyeon Kuk, Seungmin Han, Bong Ho Kim, Joon Pyo Kim, Seongkwang Kim, Seung‐Yeop Ahn, Min Hyuk Park, Jae‐Hoon Han, Sanghyeon Kim
SJR Q2IEEE Transactions on Electron Devices

HfZrO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><i>x</i></sub> -based Si n-/p-type ferroelectric field-effect transistors (n/pFEFETs) were investigated from 300 to 82 K with pulse measurements, which disclosed device physics at low temperatures. Moreover, FEFET shows extremely improved performance (read-after-write latency < 100 ns and write endurance <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org

Electrical and Electronic EngineeringEngineering
11
Preprint|3 citations·2020
Transciphering Framework for Approximate Homomorphic Encryption (Full Version)
Ji‐Hoon Cho, Jincheol Ha, Seongkwang Kim, Byeonghak Lee, Joohee Lee, Jooyoung Lee, Dukjae Moon, Hyo‐Jin Yoon
IACR Cryptology ePrint Archive
Artificial IntelligenceComputer Science
12
Article|3 citations·2022
A sub-micron-thick InGaAs broadband (400-1700 nm) photodetectors with a high external quantum efficiency (>70%)
Dae‐Myeong Geum, Jinha Lim, Junho Jang, Seung-Yeop Ahn, Seongkwang Kim, Joonsup Shim, Bong Ho Kim, Juhyuk Park, Woo Jin Baek, Jaeyong Jeong, Sanghyeon Kim
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

A sub-micron-thick InGaAs photodetectors (PDs) with a broad spectrum coverage (400-1700 nm) and high external quantum efficiency (EQE) (>70%) were successfully demonstrated through guided-mode resonance structure and surface layer thinning process. It showed the outstanding EQE of 83.8%, and 65.5% at 1000 nm, 1550 nm for 500-nm-thick InGaAs absorption layer, respectively. Compared to previous results, thickness reduction by 6.8 times and comparable QE were simultaneously achieved.

Surfaces, Coatings and FilmsMaterials Science
13
Article|2 citations·2017
Heterogeneous integration toward monolithic 3D chip
Sanghyeon Kim, Seongkwang Kim, Jae‐Phil Shim, Dae‐Myeong Geum, Gunwu Ju, Han Sung Kim, Hee Jung Lim, Hyeong Rak Lim, Jae‐Hoon Han, Chang‐Mo Kang, Dong‐Seon Lee, Jin Dong Song

Monolithic 3D (M3D) integration has attracted lots of attentions to continue equivalent scaling by vertically stacking transistors [1]. It allows the reduction of the interconnect delay, resulting in reduction of the power consumption of the chip, which is the attractive driving force for M3D integration. Moreover, with M3D, many other components such as digital, analog, MEMS, sensors, etc. can be heterogeneously integrated together in a single chip to provide enhanced functionality (Fig. 1). In

Electrical and Electronic EngineeringEngineering
14
Article|2 citations·2024
Private Computation on Common Fuzzy Records
Kyoohyung Han, Seongkwang Kim, Yongha Son
Proceedings on Privacy Enhancing TechnologiesOA

Private computation on common records refers to analyze data from two databases containing shared records without revealing personal information. As a basic requirement for private computation, the databases involved essentially need to be aligned by a common identification system. However, it is hard to expect such common identifiers in real world scenario. For this reason, multiple quasi-identifiers can be used to identify common records. As some quasi-identifiers might be missing or have typo

Artificial IntelligenceComputer Science
15
Article|2 citations·2019
Monolithic lntegratIon of GaAs//InGaAs photodetectors for multicolor detection
Dae‐Myeong Geum, Sanghyeon Kim, Seongkwang Kim, Sooseok Kang, Jihoon Kyhm, Jin-Dong Song, Won Jun Choi, Euijoon Yoon

Multicolor photodetectors (PDs) by using bulk p-i-n based visible GaAs and near-infrared (IR) InGaAs PD have been successfully fabricated via monolithic integration by wafer bonding and epitaxial lift-off. It showed high-performance individual operation comparable to that of bulk PDs with tight vertical alignment on a single substrate for future high-resolution multicolor PDs. At the same time, it covered a broad wavelength range from visible to IR.

Electrical and Electronic EngineeringEngineering

Research Areas

Artificial IntelligenceElectrical and Electronic EngineeringMaterials ChemistrySurfaces, Coatings and FilmsPolitical Science and International RelationsComputer Networks and Communications

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