Ye-Hwan Jeong
Hanyang University · 工学
研究室紹介
Professor Ye-Hwan Jeong's research lab specializes in advanced materials and plasma-based technologies for next-generation electronic and energy applications. The lab focuses on developing flexible and reliable packaging solutions such as Chip-on-Film (COF) technology for high-performance displays, while also pioneering novel ionic gels with self-healing, freeze-resistant, and thermally stable properties for wearable electronics. Key research directions include plasma surface engineering for material enhancement, advanced bonding techniques for miniaturized electronics, and functional materials for sustainable and smart electronic systems. The lab integrates plasma processing, materials synthesis, and device integration to address challenges in electronics reliability, miniaturization, and environmental resilience.
Research Overview
Research Output Trend
Figures are computed from collected data and may differ slightly.
Selected Papers
5Summary form only given. Non-thermal properties of low pressure spraying plasma have been characterized by optical emission spectroscopy and electric probes installed in a fast scanning probe system. Two-temperature model of electron is introduced to explain the nonisothermal properties of electrons, which are measured by electric probes. Excitation temperatures of atomic and ionic lines are calculated from the measurement of emission intensities of Ar (I) and Ar (II), and they explain local the
Summary form only given. Surface modification of deformed steel bar was done with plasma nitriding technology to improve the corrosion resistance. In this experiment, pulsed DC plasmas were used with various processing parameters such as pressure, nitriding time, temperature, gas compositions, etc. It was found that various compound layers can be obtained depending on carefully selected plasma parameters. The depth of diffusion layers were measured up to several hundred micrometers. The corrosio
Ionic gels have emerged as versatile materials for electronic applications such as thermal sensors, motion sensors, and health monitoring. However, their broader application remains limited by challenges such as inadequate thermal stability, susceptibility to freezing, and the absence of self-healing capabilities. In this study, a solvent-free poly(deep eutectic solvent) (PDES) gel was developed with enhanced thermal stability, freeze resistance, mechanical stretchability, and autonomous self-he
본 논문은 전자 기기의 소형화와 유연성을 실현하기 위한 플렉시블 패키징 핵심 기술 중 하나인 Chip On Film(COF) 기술에 대해 논의합니다. COF는 Display Driver IC(DDI)를 유연한 폴리이미드(Polyimide) 기판에 직접 부착하여, 고해상도 디스플레이의 경량화와 두께 감소를 가능하게 합니다. COF 기술은 주로 Organic Light Emitting Diode(OLED) 디스플레이와 같은 고성능 디스플레이 패널에서 사용되며, 스마트폰과 웨어러블 기기와 같은 휴대용 전자장치에서 핵심적인 역할을 합니다. 본 연구에서는 COF의 주요 구성 요소 및 본딩 기술의 발전을 분석합니다. 특히, 열압착(Thermo-Compression Bonding), 초음파 본딩(Thermo-sonic Bonding)과 같은 최신 본딩 기법의 도입으로, 본딩 신뢰성및 전기적 성능이 크게 향상되었습니다. 이러한 본딩 기술은 미세 피치 구조에서 높은 전기적 연결성을 유지하면서도, C