이재선 교수

<para xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> For a given heat sink thermal resistance and ambient temperature, the temperature of an electronic device rises fairly linearly with increasing device heat flux. This relationship is especially problematic for defense electronics, where heat dissipation is projected to exceed 1000 <formula formulatype="inline"> <tex Notation="TeX">${\hbox {W}}/{\hbox {cm}}^{2}$</tex></formula> in the near future. Dir

For a given heat sink thermal resistance and ambient temperature, the temperature of an electronic device rises fairly linearly with increasing device heat flux. This relationship is especially problematic for defense electronics, where heat dissipation is projected to exceed 1000 W/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> in the near future. Direct and indirect low temperature refrigeration cooling facilitate appreciable reduction

While most recently electronic cooling studies have been focused on removing the heat from high-power-density devices, the present study also explores means of greatly decreasing the device operating temperature. This is achieved by incorporating a microchannel heat sink as an evaporator in an R134a refrigeration loop. This system is capable of maintaining device temperatures below 55°C while dissipating in excess of 100W∕cm2. It is shown that while higher heat transfer coefficients are possible