한종인 교수

Gold electroless plating for surface finishing of electronic circuits, named electroless nickel immersion gold (ENIG), is widely practiced in the electronics packaging industry. Noncyanide substitutions of the current cyanide bath for immersion gold are being sought for environmental and safety reasons. Herein, as a promising option, a bath using a noncyanide gold complex, Au(I)–thiourea, was developed. The kinetics of gold deposition were estimated with respect to gold concentration, thiourea c

Iron(II) thiochelates, especially iron(II) 2,3-bis(sulfanyl)propane-1-sulfonate (Fe(II)(DMPS)2), have received particular attention as nitric oxide (NO) absorbents because they maintain high NO removal efficiency even in the presence of O2 in flue gases. Herein, we explored the O2-inducing oxidation kinetics of Fe(II) and thiol groups (R–SH) in Fe(II)(DMPS)2 and analyzed the resultant products to understand the resistive behavior toward O2. Quantitative analysis revealed that 4 mM of Fe(II) in 1